| 19th June - QUALCOMM announced a significant milestone in
semiconductor process technology as multiple 3G handsets powered
by the Company's 65-nanometer (nm) chipsets began their worldwide
commercial launch.
t least three handset models are now commercially available
and more than 40 additional models are expected to become
available this year. The world's first 3G handsets based on
65 nm chips, these models leverage the 65 nm node of semiconductor
manufacturing for cost effectiveness, greater power efficiency
and slimmer form factors while supporting the high-speed data
capabilities and advanced service opportunities offered by
3G technology. "QUALCOMM is committed to continually
raising the bar for wireless users, delivering richer functionality
that is more affordable and offers a better experience,"
said Steve Mollenkopf, senior vice president of product management
for QUALCOMM CDMA Technologies.
"We are pleased to reach this milestone in cutting-edge
process technology, together with our customers, and we look
forward to enabling additional slim, smart and power-efficient
3G devices for the worldwide market." The handset models
are based on 65 nm Mobile Station Modem(TM) (MSM(TM)) chipsets
manufactured for QUALCOMM by Taiwan Semiconductor Manufacturing
Company (TSMC), the world's largest foundry company. The 65
nm handset models include: -- The WCDMA (UMTS) U120 handset
by Huawei -- The WCDMA (UMTS) KU250 handset by LG Electronics
-- The HSDPA U700 handset by Samsung
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